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Balletto B1 Series

BLE-Connected Wireless Microcontrollers

The Balletto family is a complete AI/ML microcontroller solution for connected IoT platforms with integrated Bluetooth Low Energy 5.3 and 802.15.4 wireless subsystem and a dedicated network co-processor, enabling connectivity without the need for a separate chip. Employing the same architecture as the Ensemble family, Balletto utilizes the Cortex-M55 CPU plus the Ethos-U55 neural processor for amazingly efficient Edge ML processing.

Key Benefits of B1:

  • BLE 5.3 + 802.15.4 radio subsystem

  • 46 GOPs of extreme low-power on-chip AI/ML processing

  • Heavy DSP processing capability ideal for audio

  • Wide selection of camera, audio, sensor and communication interfaces

  • Precision analog measurement

  • Tiny packaging down to a WLCSP with footprint of just 3.9mm x 3.9mm

B1 SPECIFICATIONS

High-Efficiency MCU Core
  • Arm® Cortex®-M55 Core, up to 160 MHz, with Helium™ Vector Processing Extension, Double-Precision FPU, 2MB of SRAM 0-wait State Tightly Coupled Memory, 16KB Instruction and Data Caches, Armv8.1-M ISA with Arm TrustZone®, and 4.37 CoreMark®/MHz Performance Benchmark
  • High-Performance 64-bit AXI Bus Fabric
Efficient Micro NPU for AI/ML Acceleration
  • 1× Arm Ethos™-U55 Neural Processing Unit— 128 MAC/cycle up to 46 GOPS, On-the-Fly Weight Decompression with Dedicated DMA Controller
  • Up to Two Orders of Magnitude Uplift in Performance and Power Efficiency per ML Inference Compared to Same ML Model Running on Typical Previous Generation Cortex-M Cores without Neural Processing Acceleration
2.4 GHz BLE 5.3 / IEEE 802.15.4 Transceiver
  • Dedicated Transceiver Processing Subsystem – No Burden on Application
  • Bluetooth® Low Energy 5.3 Compliant
  • IEEE 802.15.4 2015 Compliant
  • BLE Rx Sensitivity: -99 dBm
  • 2.0 mA Tx current at 3.3 V, 0 dBm Output
  • 1.5 mA Rx current at 3.3 V, 1 Mbps
  • Integrated RF Power Amplifier, up to +10 dBm Tx
  • Integrated RF Balun
  • LE Audio with Low Complexity Comm Codec (LC3)
  • Bluetooth Direction Finding—AoA and AoD
  • Bluetooth Mesh
  • All BLE Standard Profiles Supported On-Chip
  • Mobile Wireless Standards (MWS) Coexistence Control
Extreme-Low Power Technology
  • Autonomous Intelligent Power Management (aiPM™)
  • FD-SOI Low Leakage Process
  • 700 nA at 3.3 V Consumed in STOP Mode with LPRTC Running; 400 µs Wake Time from STOP Mode
  • As Low as 22 µA/MHz Dynamic Consumption for High-Efficiency Cortex-M55 at 3.3 V
On-Chip Application Memory
  • Not Used by BLE/15.4 Transceiver Functions
  • High Endurance MRAM Non-Volatile Memory
    • Up to 1.9MB
  • SRAM
    • Up to 2MB Zero Wait-State with Optional Retention in Increments of 64KB (450 nA), 128KB (900 μA), 256KB (1.8 μA), 512KB (3.6μA), 1MB (7.2 μA), 2MB (14.4 μA)
External Memory Interfaces
  • 1× Octal SPI at up to 80 MHz for up to 80 MB/s SDR, 160 MB/s DDR, with Inline AES Decryption, XIP Mode Support, HyperBus Protocol Support, Enabling External Memory Expansion, QSPI Support
  • 1× SD® v4.2, eMMC™ v5.1 Channel with DMA
Secure Enclave
  • Hardware-based Root-of-Trust (RoT) with Unique Device ID
  • Secure Key Generation and Storage, Secure Certificate Storage
  • Factory-provisioned Private Keys
  • Crypto Accelerators—AES (up to AES-256), ECC (up to 384 bits), SHA (up to SHA-256), RSA (up to RSA-3072), and NIST compliant TRNG
  • Secure Debugging with Certificate Authentication
  • Secure RTC
  • Complete Secure Lifecycle Management
Timing Control and Measurement
  • 4× Universal High-Resolution 32-bit Timers, Quadrature Encoder/Decoder (QEC) Enabled
  • 1× Watchdog Timer
  • 2× Low-Power 32-bit Timers
  • 1× Real-Time Counter
Serial Communication Interfaces
  • 1× USB 2.0 HS/FS Device with DMA
  • 1× SDIO v4.1 Channel with DMA
  • 2× CAN FD Channel up to 10 Mbps
  • 1× MIPI® I3C® Channel
  • 2× I2C Channels up to 3.4 Mbps Throughput
  • 1× Low-Power I2C Channel
  • 6× UART Channels up to 2.5 Mbps (2× with RS-485 Driver Control)
  • 1× Low-Power UART Channel
  • 3× SPI Channels up to 50 Mbps Throughput
  • 1× Low-Power SPI Channel
Analog Interface Capabilities
  • 2× 12-bit ADC (12 Single-Ended Inputs)
  • 1× 24-bit Sigma-Delta ADC (4 Differential Inputs)
    • Programmable Gain Instrumentation Amplifier (1× to 128×)
  • 1× 12-bit DAC (l channel)
  • 2× High-Speed Analog Comparators (8 Inputs)
  • 1× Low-Power Analog Comparator (4 Inputs)
  • Internal Temperature Sensor
  • Internal Precision Reference Voltage
Camera Interfaces
  • 1× Low-Power Camera Parallel Interface (LPCPI), up to 8 bits
Display Interfaces & Graphics
  • Graphics LCD Controller
  • 1× Display Parallel Interface (DPI), up to 24-bit RGB
  • 1× 1-Lane MIPI DSI®
  • D/AVE 2D Graphics Processing Unit
Audio Interfaces
  • 2× I2S Synchronous Stereo Audio Interfaces
  • 1× Low-Power I2S Stereo Audio Interface
  • 4× 2-channel Low-Power Pulse Density Modulation (LPPDM) Microphone Inputs (8 Mono Microphones)
General Input/Output
  • Up to 71× 1.8-V GPIOs (Shared with Peripherals)
  • Up to 6× Selectable 1.8-V to 3.3-V GPIOs (Shared with Peripherals)
Clock Generation
  • LFRC – Internal Low-Frequency RC Oscillator (32.7 kHz, ±4%)
  • HFRC – Internal High-Frequency RC Oscillator (Up to 76.8 MHz, ±1%)
  • LFXO – External Low-Power Crystal Oscillator or Quartz Crystal (32.768 kHz)
  • HFXO – External High-Frequency Crystal Oscillator or Quartz Crystal (24 MHz to 38.4 MHz)
  • One User Fractional Mode PLL, One Fractional Audio PLL
System
  • General DMA Controller
  • CRC Calculation Accelerator with Programmable Polynomials
  • Programmable Low Supply Voltage Detect Warning (Brown-Out Detect)
  • Power-On Reset and Brown Out Reset
  • Real-Time Clock
  • JTAG/SWD Debug Interface
Operating Parameters
  • 1.71 V to 4.5 V Primary Supply Range
  • -40 °C to 105 °C Industrial Ambient Temperature Range
  • -40 °C to 125 °C Industrial Junction Temperature Range
Packages
  •  FBGA120, 6.6 mm x 6.6 mm, 0.5 mm Pitch
  • WLCSP90, 3.9 mm x 3.9 mm, 0.4 mm Pitch
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